Development of a high density pixel multichip module at Fermilab
作者： Guilherme Cardoso , Sergio Zimmermann , Jeffry Andresen , Jeffrey A Appel , Gabriele Chiodini
DOI: 10.1109/TADVP.2002.1017683
关键词:
摘要: At Fermilab, both pixel detector multichip module and sensor hybridization are being developed for the BTeV experiment. The is composed of three layers. lowest layer formed by readout integrated circuits (ICs). backs ICs in thermal contact with supporting structure, while tops flip-chip bump bonded to a sensor. A low mass flex-circuit interconnect glued on top this assembly, IC pads wire-bonded circuit. based design relying hybrid approach. This method offers maximum flexibility development process, choice fabrication technologies, material. paper presents strategies handle required data rate performance characteristics prototypes.
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