作者: M. A. Quevedo-Lopez , S. A. Krishnan , P. D. Kirsch , G. Pant , B. E. Gnade
DOI: 10.1063/1.2150586
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摘要: A hafnium silicon oxynitride gate dielectric with a universal channel mobility of ∼90% at 1MV∕cm, equivalent oxide thickness approximately 1nm, and leakage current 200× less than SiO2 is reported. X-ray photoelectron spectroscopy results suggest that the small peak loss observed in scaled HfSiON may be attributed to increased Si–N bonding near interface. In accordance these results, Si–N:Hf–N bond ratio decreases increasing physical thickness. Threshold voltage instability 1nm 10mV after 1000s stress 22MVcm. ΔVTH monotonically increases This associated greater crystallization thicker films.