Strained Channel Dynamic Random Access Memory Devices

作者: Anthony J. Lochtefeld , Mayank T. Bulsara , Matthew T. Currie

DOI:

关键词:

摘要: DRAM trench capacitors formed by, inter alia, deposition of conductive material into a or doping the semiconductor region in which is defined.

参考文章(84)
Anthony J Lochtefeld, Mayank Bulsara, Matthew T Currie, Christopher W Leitz, Selective placement of dislocation arrays ,(2003)
Douglas James Tweet, Jer-shen Maa, Jong-Jan Lee, Sheng Teng Hsu, Process integration of Si1-xGex CMOS with Si1-xGex relaxation after STI formation ,(2002)
Howard Smith Landis, Peter John Geiss, Son Van Nguyen, Shrink-wrap collar for DRAM deep trenches ,(1995)
Atsushi Kurobe, Naoharu Sugiyama, Semiconductor device and memory device ,(1997)
Jack A. Mandelman, Rajarao Jammy, Carl J. Radens, DRAM trench capacitor ,(1999)
Gary W. Rubloff, Vishnubhai V. Patel, Alfred Grill, Gottlieb S. Oehrlein, Rodney T. Hodgson, High area capacitor formation using material dependent etching ,(1992)