Full-enclosure, controlled-flow mini-environment for thin film chambers

摘要: An enclosure for generating a secondary environment within processing chamber coating substrate. wall forms encompassing the source, plasma, and substrate, separating them from interior of chamber. The includes plurality pumping channels diverting gaseous flow away have an intake larger diameter exhaust opening are oriented at angle with pointing deposition source. A movable seal enables transport substrate in open position closed position. may be formed as labyrinth to avoid particle generation standard contact seal.