Process for the positioning of an interconnection line on an electrical contact hole of an integrated circuit
作者： Pierre Jeuch
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摘要: The invention relates to a process for the positioning of an interconnection line on electric contact hole in integrated circuit. According invention, one or more conductive layers forming covering are deposited complete first layer is by isotropic process. be produced then masked resin layer, followed successive etching each layer. Finally, overetching these effected hole, elimination resin.
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