In situ and real-time metrology during rinsing of micro- and nano-structures

摘要: A new technology, called electro-chemical residue sensor (ECRS), has been developed for the in situ and real-time measurement of residual impurities left on wafer surface fine structures patterned wafers during typical rinse processes. The key components this which consist hardware a process model, are described. testing results ECRS show that impurity concentration is significantly different from what typically provided by bulk water resistivity, usually employed determining progress rinse. As case study, metrology method applied to removal sulfate ions wafers; importance various interactions, charge effects, transport processes determined. Two examples use development novel recipes reduce usage also discussed.