Fine line metallization by coextrusion technology for next generation solar cells

摘要: Abstract This paper introduces the application of a coextrusion printing as contact and mask-free fine line metallization technology for direct narrow grid lines with strongly enhanced aspect ratio. Coextrusion printed enhance short circuit current lower series resistance through higher number filigree fingers. The silver sacrificial paste that merge inside nozzle are simultaneously extruded onto wafer form structure smaller than every design feature nozzle. After firing become 35 µm an ratio up to 0.7. A further shrinkage potential down 23.7 µm width 0.62 has been demonstrated. outperform screen in whole slew geometrical optical properties. As example height variation is low ±0.5 µm effective finger far width. Due these widths absolute shading 96 less half 80 lines. calculated gain, due was experimentally confirmed accordingly. Furthermore benchmark test production like environment performed. Hereby cell efficiency gain +0.25% over +0.35% +0.4% abs. can be assumed achieved by using contacting paste, which comparable state art pastes.