Process Development for a High-Throughput Fine Line Metallization Approach Based on Dispensing Technology
作者： M. Pospischil , M. Klawitter , M. Kuchler , J. Specht , H. Gentischer
DOI: 10.1016/J.EGYPRO.2014.02.001
关键词:
摘要: In order to enhance prosperous dispensing technology towards an industrial application, besides a continuous process development, especially throughput rate has be increased. this study, paste rheology of two different pastes was transferred CFD-simulation (CFD: Computational Fluid Dynamics) investigate nozzle geometries and print head designs. the following, single setup used verify simulative values by comparing them with those obtained from experimental investigations. Consequently, scaled parallel where homogeneous pressure flow distribution within turned out crucial achieve mass at all nozzles. various iteration steps, influence fabrication tolerances concerning geometry isolated designs were optimized based on CFD maximum stability. Based these results, novel 10 fine line unit designed fabricated. Finally, successful cell production resulting finger widths less than 35 μm could demonstrated using prototype.
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