Vertical Thermopiles Embedded in a Polyimide-Based Flexible Printed Circuit Board
作者： Hanna Yousef , Klas Hjort , Mikael Lindeberg
DOI: 10.1109/JMEMS.2007.907783
关键词:
摘要: A fabrication process for vertical thermopiles embedded in a 75-mum-thick polyimide foil has been developed flexible printed circuit boards (flex PCBs). The connections consist of electrodeposited antimony-and nickel-plated through-hole vias. plated vias multiple wires, with total metal content that is 1% the via volume. technique similar to standard flex PCB wet etch and metallization processes. main difference foils are pretreated ion irradiation induce highly selective rates. were characterized by measuring their voltage response an applied temperature across thickness.
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