Influences of in situ annealing on microstructure, residual stress and electrical resistivity for sputter-deposited Be coating
作者： B.C. Luo , K. Li , X.L. Tan , J.Q. Zhang , J.S. Luo
DOI: 10.1016/J.JALLCOM.2014.03.128
关键词:
摘要: Abstract The Be coating grown on K9 substrate are fabricated at different annealing temperatures by dc magnetron sputtering, and they composed of α-Be phase with hcp structure from XRD analysis. As the in situ increase 60 °C to 410 °C, surfaces show transition fibrous grains dominated surface diffusion diamond-like grains, then recrystallized bulk diffusion. For cross-section morphologies, always characterized coarsening columnar distinct boundaries. Both roughness grain size temperatures, obey modified Anelli model. Moreover, constitutive relationship was explored. residual stress is related closely microstructures not only displays tensile but also compressive stress. compression–tension temperature occurs near 250 °C (0.34 T m ), which just recrystallization temperature. film electrical resistivity values decrease gradually due reduction boundary.
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