Overview and applicability of residual stress estimation of film–substrate structure
作者： Tsung-Lin Chou , Shin-Yueh Yang , Kuo-Ning Chiang
DOI: 10.1016/J.TSF.2011.04.220
关键词:
摘要: … , and interfacial peeling stress) in a film–substrate circular … residual stress of thin film deposits on substrate, and understanding of the applicability range of formula for thin film stress …
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