Back-side illuminated pixels with interconnect layers

作者: Sergey Velichko , Christopher Silsby

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摘要: An imaging pixel may be provided with an upper substrate layer, a lower floating diffusion region in the and photodiode layer that is coupled to region. The also include source follower transistor interconnect between layer. couple directly transistor. reset metal transfer couples

参考文章(102)
Jon J. Candelaria, Paige M. Holm, Vertically integrated photosensor for CMOS imagers ,(2003)
Howard E. Rhodes, CMOS imager and method of formation ,(2003)
Seung-sik Kim, Eun-sub Shim, Moo-Sup Lim, Min-Seok Oh, Dong-Joo Yang, Young-Chan Kim, Tae-Han Kim, Image sensor and method of manufacturing the same ,(2008)
Fukashi Morishita, Shunsuke Okura, Solid-state image sensing device and electronic device ,(2015)
Yuichiro Yamashita, Po-Sheng Chou, Integrated circuit having a level shifter ,(2014)
Richard J. Rassel, Jeffrey P. Gambino, Daniel N. Maynard, Raymond J. Rosner, Kevin N. Ogg, Optical Sensor Including Stacked Photosensitive Diodes ,(2008)