Low temperature, bump-bonded radiation imaging device
作者： Mikko Ilmari Vuorela
DOI:
关键词:
摘要: An x-ray and gamma-ray radiant energy imaging device is disclosed having a temperature sensitive semiconductor detector substrate bump-bonded to CMOS readout substrate. The sensitive, utilizes Tellurium compound materials, such as CdTe CdZnTe. bump bonds are formed of low-temperature, lead-free binary solder alloy melting point between about 100 °C 180 °C. Also described process for forming bumps utilizing the alloy, prevent damage potentially brittle when assembling device.
lens.org 参考文章(14)
Neil Thomson Gordon, Charles Thomas Elliott, Anthony Michael White, Noise reduced photon detector ,(1999)
Kenneth Cholewczynski, Cynthia M. Melton, Kevin D. Moore, Carl Raleigh, Low temperature method for forming solder bump interconnections to a plated circuit trace ,(1992)
Masahiko Furuno, Kazuhide Doi, Tsugunori Masuda, Hideo Aoki, Bump forming method, presoldering treatment method, soldering method, bump forming apparatus, presoldering treatment device and soldering apparatus ,(2002)
Cynthia Melton, Method for forming gold bump connection using tin-bismuth solder ,(1993)
Zaheed Sadrudin Karim, Edwin Wai Ming Cheung, Method of forming lead-free bump interconnections ,(2000)
Charles Gerard Woychik, Amit K. Sarkhel, Lead-free, tin-based multi-component solder alloys ,(1996)
Jeffrey Donald Gelorme, Sampath Purushothaman, Sung Kwon Kang, High conductivity, high strength, lead-free, low cost, electrically conducting materials and applications ,(1997)
Kenichiro Suetsugu, Atsushi Yamaguchi, Yoshinori Sakai, Solder alloy of electrode for joining electronic parts and soldering method ,(1997)
Tetsuya Nakatsuka, Tasao Soga, Koji Serizawa, Hanae Shimokawa, Kazuma Miura, Semiconductor module having solder bumps and solder portions with different materials and compositions and circuit substrate ,(2001)
Konstantinos Evengelos Spartiotis, Semiconductor imaging device ,(1998)