Methods of forming ruthenium-containing films by atomic layer deposition

作者: Neil Boag , Jeff Anthis , Ravi Kanjolia , Rajesh Odedra

DOI:

关键词:

摘要: A method of forming ruthenium-containing films by atomic layer deposition is provided. The comprises delivering at least one precursor to a substrate, the corresponding in structure Formula I: (L)Ru(CO)3 wherein L selected from group consisting linear or branched C2-C6-alkenyl and C1-6-alkyl; optionally substituted with more substituents independently C2-C6-alkenyl, C1-6-alkyl, alkoxy NR1R2; R1 R2 are alkyl hydrogen.

参考文章(15)
Er-Xuan Ping, David J. Kubista, Lyle D. Breiner, Cem Basceri, Kevin L. Beaman, Ronald A. Weimer, Trung T. Doan, Lingyi A. Zheng, Methods for forming small-scale capacitor structures ,(2004)
S. Dosanjh, P. Cannard, R. Firth, I. Lealman, R. Moore, L. Rivers, M. Robertson, S. Rushworth, R. Odedra, P. Viswanathan, D. E. Sykes, A. Chew, The development and application of novel Ru precursors for atmospheric pressure MOVPE growth of Ru doped current blocking layers international conference on indium phosphide and related materials. pp. 1- 3 ,(2008) , 10.1109/ICIPRM.2008.4702915
Sachiko Hashimoto, Tatsuya Sakai, Yasuo Matsuki, Ruthenium compound and process for producing a metal ruthenium film ,(2003)
Anthony Copeland Jones, Precursors for chemical vapor deposition ,(2002)