Thin film encapsulation technology for harms using sacrificial CF-polymer
作者： D. Reuter , A. Bertz , M. Nowack , T. Gessner
DOI: 10.1016/J.SNA.2007.11.002
关键词:
摘要: Abstract This paper reports on a new method for thin film encapsulation of microelectromechanical systems (MEMS) using plasma enhanced chemical vapor deposited (PECVD) fluorocarbon polymer as sacrificial material and stress optimized SiO/SiN/Al capping layer. Because the oxygen plasma-based removal organic layer, this technique is applicable wide range MEMS technologies—from surface to high aspect ratio microstructures. It saves die area compared with bonding techniques enables standard packaging processes such dicing, pick place plastic injection molding. Beside fabrication technology, we present results finite element analysis (FEA) regarding deflection mechanical in cap. The FEA have been verified fabricated structures by interferometric measurements.
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