In-line adhesion monitoring and the effects of process variations on adhesion in MEMS

摘要: Capacitive microinstruments with compliant electrodes for accurate determination of small adhesion force between polycrystalline silicon surfaces are presented. The test structures can determine the as low 60nN. Using these devices, effects fabrication and release variations on investigated. measurement results show that does not depend apparent contact area over range parameters examined. Moreover, a distinct difference values measured wafers different processes is observed attributed to surface topography. distribution in 8" also studied found uniform throughout single wafer.