Semiconductor device having a metalized via hole

摘要: A semiconductor device having a metalized via hole used when mounting and connecting chips, such as microwave digital analog chips the like, on top portion of carrier substrate is described herein. Each chip includes electrical circuitry thereof with connected to one end transmission line. Another line hole. The passes from bottom chip. mounted positioned over lowered thereon either by hand or mechanical carrying device. indexed indexing tolerance between two interfacing surfaces in range 0.5 10 mils. close less than mil up mils greater may vary depending frequency application. Also, connection allows for proper alignment uniform impedance transition substrate. After substrate, bonded be attached using solder. very thin layer solder minimize thermal resistance establish necessary integrity chip-to-substrate interface attachment.