Direct backside interconnect for multiple chip assemblies

摘要: A plurality of integrated circuits, such as microwave monolithic circuits (MMICs), is supported upon a common carrier substrate having transmission lines for interconnection signals between terminals any one the MMICs and among MMICs. Circuit at front sides respective are connected electrically by vias to back be adjacent conductive components lines. Electrically bumps metal or epoxy serve connect lines, also metallized regions substrate.