Integrated circuit component and manufacture thereof

摘要: PURPOSE: To provide integrated circuit components where a ceramic multilayer substrate with at least one type of passive element which is selected from an inner wiring or group L, C, and R active such as thin film transistor, etc., by metal bump conductive paste bonding. CONSTITUTION: A 1 transistor formed 2 are connected electrically paste. COPYRIGHT: (C)1992,JPO&Japio