Method of manufacturing a hybrid integrated circuit component having a laminated body
作者： Yukio Yamauchi , Katsuto Nagano , Michio Arai , Naoya Sakamoto
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摘要: A hybrid (composite) integrated circuit element comprises a substrate, thin film type formed on substrate through process, and lamination passive such as capacitor, inductor, resitance combination thereof the circuit. During firing of in hydrogen atmosphere, semiconductor layer which constitutes is also heat annealed. Various substrates can be used for example, quartz, ceramic cheap has not been treated with mirror-grinding by use glass layer.
lens.org 参考文章(10)
Jorge M. Hernandez, Aleta Gilderdale, Decoupling capacitor for surface mounted leadless chip carriers, surface mounted leaded chip carriers and Pin Grid Array packages ,(1987)
Junichi Ohno, Takao Ohta, Implanting yttrium and oxygen ions at semiconductor/insulator interface ,(1983)
Michael Gdula, Eric J. Wildi, Wolfgang Daum, Raymond A. Fillion, Herbert S. Cole, Robert J. Wojnarowski, Method for fabricating an integrated circuit module ,(1993)
Dong-Joo Bae, Won-Shik Baek, Kyu-Hyun Chio, Process for producing a stacked capacitor of a dram cell ,(1990)
Manfred J. Schindler, Shiou L. L. Chu, Field effect transistor having an integrated capacitor ,(1989)
Joseph Pinel, Christian Val, Yves B. Gibod, Radiation-hardened casing for an electronic component ,(1984)
Robert B. Gordon, Cover for a semiconductor package ,(1986)
Nobuo Furukawa, Mitsufumi Kodama, Masaaki Ikeda, Integrated circuit component and manufacture thereof ,(1991)