作者: Wing Chiu Jason Tam , Ronald D. Blanton
DOI: 10.1109/TCAD.2015.2406854
关键词:
摘要: Systematic defects within integrated circuits (ICs) are a significant source of failures in nanoscale technologies. Identification systematic is therefore very important for yield improvement. This paper discusses diagnosis-driven defect identification methodology that we call layout analysis IC-defect using clustering (LASIC). By images the locations correspond to diagnosed sites statistically large number IC failures, LASIC uncovers common features. To reduce computation time, only dominant coefficients discrete cosine transform used clustering. applied an industrial chip and it found be effective. In addition, detailed simulations reveal both accurate