Etching fluid, replenishing fluid, and method for forming copper wiring

摘要: Provided are an etching fluid that is capable of suppressing side while not impairing the linearity copper wiring, a replenishing for same, and method forming wiring. This characterized in being aqueous solution containing acid, oxidizing metal ions, compound (A), (A) having molecules thereof amino group at least one sulfur-containing functional selected from consisting thiole groups, sulfide disulfide groups (where which sulfur atoms heteroatoms linked thereto by single bond, do form π conjugates).