Slurry formulation for chemical mechanical polishing of metals

摘要: Buffered slurries are used in a semiconductor process for chemical mechanical polishing of metal layers, such as aluminum or titanium. The may comprise an oxidant capable causing passive oxide film to form on based layer. diluent and be optionally formulated with separate oxidizing agent, ammonium peroxydisulfate. include buffer that maintains slurry pH where the is stable. This between about 4 9.