作者: Pathirana , F Udrea , E Napoli
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摘要: Many vertical IGBT models are currently available. They have also been implemented in commercial simulators and describe device behavior both steady-state transient. However, no reliable proposed for the Lateral that is widely used field of smart power integrated circuits. In this paper a complete physical model fabricated Silicon On Insulator technology developed. The Pspice circuit simulator. Model results compared against finite element simulation. A comparison with most common shows not able to correctly predict behavior. LIGBT accounts static transient isothermal conditions. simulator two-dimensional numerical simulations experimental results. section II main differences between lateral highlighted. III IV transients equations presented. V sub-circuit shown. Section VI presents 2D simulations. MAIN DIFFERENCES BETWEEN AND VERTICAL schematic SOI considered our analysis shown Fig. 1. It 600V punch-through device. buffer layer is, however, lightly doped so during on-state charge concentration higher than its doping behaves like non state carrier