作者: Jiyong Woo , Jeonghwan Song , Kibong Moon , Seokjae Lim , Daeseok Lee
DOI: 10.1109/NVMTS.2014.7060853
关键词:
摘要: In this paper, a bipolar resistive random access memory (RRAM) device with fab-friendly materials stack (TiN/Ti/HfO 2 /TiN) and process in via-hole substrate 200 nm cell size was successfully demonstrated on an 8-inch wafer scale. Furthermore, the robust characteristics reliable switching uniformity stability were experimentally confirmed at level. Finally, from standpoint of array architecture, fabricated evaluated various selector devices such as conventional silicon-based transistor newly developed tunneling-based diode device.