Method and circuit testing apparatus for equalizing a contact force between probes and pads

摘要: This invention presents a method and mechanism for contacting set of vertical probes circuit testing with pads or bumps under test. The have circular cross section, tip portion length L1 beam L2, such that the extends at right angle to portion. is guided through guide hole test secured by its end. In this geometry contact force between probe pad described relation: ##EQU1## where D v deflection probe, I an area moment inertia about axis, E Young's modulus probe. L2 are selected each in way F relation kept constant thus ensuring remains substantially equal.