Probe head with vertical probes, method for manufacturing the probe head and probe card using the probe head
作者： Hsiang-Ming Huang , Yi-Chang Lee , An-Hong Liu , Yao-Jung Lee
DOI:
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摘要: A vertical probe head primarily comprise a substrate, trace layer, and plurality of probes where the substrate has first surface, second device holes penetrating through surface surface. The layer is formed on Each bonding end probing ends are inserted into electrically connected to protruded away from substrate. Resins filled firmly fix so that will not easily be bent nor damaged.
lens.org 参考文章(8)
Joseph M. Moran, William E. Benedetto, Apparatus having a buckling beam probe assembly ,(1988)
Phillip E. Byrd, Method to prevent damage to probe card ,(2002)
Kazumasa Okubo, Hiroshi Iwata, Masao Okubo, Vertical probe card ,(2001)
Fu Chiung Chong, Sammy Mok, Massively parallel interface for electronic circuit ,(2006)
Bruce Jeffrey Barbara, Benjamin N. Eldridge, Method to build a wirebond probe card in a many at a time fashion ,(2005)
David R. Hembree, Salman Akram, Test insert containing vias for interfacing a device containing contact bumps with a test substrate ,(2001)
David R. Hembree, Warren M. Farnworth, James M. Wark, John O. Jacobson, Salman Akram, Mike Hess, Test carrier for testing semiconductor components including interconnect with support members for preventing component flexure ,(1998)
January Kister, Method and circuit testing apparatus for equalizing a contact force between probes and pads ,(1996)