Process for Eliminating Delamination between Amorphous Silicon Layers
作者： Jiou-Kang Lee , Ting-Hau Wu , Chun-Ren “Sean” Cheng , Hsiang-Fu “Benior” Chen , Shang-Ying Tsai
DOI:
关键词:
摘要: A circuit structure includes a substrate; first amorphous silicon layer over the glue and adjoining layer; second layer.
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