High density multi-component packages
作者： Mcconnell John E , Bultitude John , Miller Galen
DOI:
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摘要: Provided is a high density multi-component package and method of manufacturing package. The comprises at least two electronic components wherein each component the comprise first external termination second termination. At one interposer between adjacent attached to by an interconnect selected from active mechanical interposer. Adjacent are connected serially.
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