作者: Masaki Yanagisawa , Kenji Hiratsuka , Hirohiko Kobayashi , Yoshihiro Yoneda , Kenji Koyama
DOI:
关键词: Optoelectronics 、 Materials science 、 Substrate (printing) 、 Semiconductor 、 Coating 、 Integrated devices
摘要: A method of making a semiconductor optical integrated device includes the steps forming, on substrate, plurality devices including first element having bonding pad and second element; forming bar-shaped arrays by cutting each two or more devices; alternately arranging spacers in thickness direction substrate so as to be fixed place; coating film facet array. Furthermore, spacer has movable portion facing pad, protruding toward being displaceable direction.