Direct application of unpackaged integrated circuit to flexible printed circuit
作者： Eugene T. Selbitschka , Kelly D. Habeck , Keith L. Casson
DOI:
关键词:
摘要: A method is described for electrically connecting flip chips to a flexible printed circuit substrate. The comprises (1) providing solder paste plurality of active contact pads located on the substrate, (2) placing substrate such that bumps are in registration with pads, and (3) heating resulting assembly as whole so each pad reflows form an electrical connection its corresponding bump.
lens.org 参考文章(21)
Bennett J. Reding, Chandler H. McIver, Pretestable double-sided tab design ,(1987)
Christopher G. Angulas, Patrick T. Flynn, Randy L. Orr, Thomas E. Kindl, Joseph Funari, Method for bonding flexible circuit to circuitized substrate to provide electrical connection therebetween using different solders ,(1991)
Yasushi Goto, Yutaka Yamaguchi, Atsuo Nakajima, Isao Tsukagoshi, Composition for circuit connection, method for connection using the same, and connected structure of semiconductor chips ,(1989)
Christopher G. Angulas, L Orr Randy, Patrick T. Flynn, Thomas E. Kindl, Method of bonding flexible circuit to circuitized substrate to provide electrical connection therebetween ,(1991)
Harry Jordan Jones, Paul Andrew Moskowitz, Rodney Trevor Hodgson, Peter Gerard Ledermann, Timothy Clark Reiley, Balltape structure for tape automated bonding, multilayer packaging, universal chip interconnection and energy beam processes for manufacturing balltape ,(1986)
George S. LaRue, Robert A. Mueller, Steven A. Tabor, Kent H. Johnston, Kenneth R. Smith, Method of packaging integrated circuit chips, and integrated circuit package ,(1985)
Andrzej Kucharek, High density multi-chip interconnection and cooling package ,(1985)
Richard L. Swisher, Method of making metal-film laminate resistant to delamination ,(1990)
Stephen D. Senturia, David Volfson, High-density, multi-level interconnects, flex circuits, and tape for TAB ,(1990)
Shigeo Nakabu, Hiroshi Nakatani, Hisao Kawaguchi, Flat display panel with framing for flexible substrate folding ,(1987)