Workpiece distribution and processing in a high throughput stacked frame

作者: Gary R. Donaldson , William Wang

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摘要: An integrated workpiece vacuum processing system for semiconductor workpieces is provided using a stacked chamber design. The comprises multiple support unit having plurality of bays arranged in rows and columns wherein module received each bay transfer coupled to the modules.

参考文章(15)
Shinichi Moriyama, Katsuhide Watanabe, Yoichi Kanemitsu, Naoji Hiraki, Control system for a linear actuator including magnetic bearings for levitating a robot arm ,(1996)
Dan L. Cossentine, Bruce E. Mayer, Frank S. Menagh, Helder R. Carvalheira, Eric R. Vaughan, Philip A. Troiani, Richard N. Savage, Semiconductor wafer processing system with vertically-stacked process chambers and single-axis dual-wafer transfer system ,(2000)
Christopher A. Hofmeister, Robert T. Caveney, Robot handling apparatus ,(1997)
Michael W. Pippins, Richard S. Muka, Mitchell A. Drew, Door drive mechanisms for substrate carrier and load lock ,(1996)
Yoichi Deguchi, Hayashi Otsuki, Processing method and apparatus thereof ,(1993)
Thomas E. Seidel, Carl J. Galewski, Prasad N. Gadgil, Kenneth Doering, Processing chamber for atomic layer deposition processes ,(1999)
Isaac Harari, Masato Toshima, David Cheng, Peter D. Hoppe, David Nin-Kou Wang, Dan Maydan, Sasson Somekh, Multiple chamber integrated process system ,(1987)
Hiroya Nissin Elec. Co. Ltd. Kirimura, Vacuum processing device ,(1999)