Advanced setup for thermal cycling of power modules following definable junction temperature profiles
作者： A. Stupar , D. Bortis , U. Drofenik , J. W. Kolar
DOI: 10.1109/IPEC.2010.5542179
关键词:
摘要: In this paper a setup for performing power cycling tests of IGBT modules the purpose reliability analysis is presented. The main to provide experimental data parameterization and verification newly developed physical model solder deformation leading failure electronic devices. design procedure, including considerations reliability, measurement, cooling, 5 kW flexible system Experimental results sub-1 prototype are shown, demonstrating ability force junction temperature device under test follow an arbitrary profile.
sci-hub.se 参考文章(24)
F. Auerbach, A. Lenniger, Power-cycling-stability of IGBT-modules ieee industry applications society annual meeting. ,vol. 2, pp. 1248- 1252 ,(1997) , 10.1109/IAS.1997.629019
Ralf Schmidt, Uwe Scheuermann, Using the chip as a temperature sensor — The influence of steep lateral temperature gradients on the V ce (T)-measurement european conference on power electronics and applications. pp. 1- 9 ,(2009)
Mauro Ciappa, Flavio Carbognani, Wolfgang Fichtner, None, Lifetime prediction and design of reliability tests for high-power devices in automotive applications IEEE Transactions on Device and Materials Reliability. ,vol. 3, pp. 191- 196 ,(2003) , 10.1109/TDMR.2003.818148
T. J. Dolan, S. S. Manson, Thermal Stress and Low Cycle Fatigue ,(1981)
K. C. Norris, A. H. Landzberg, Reliability of controlled collapse interconnections Ibm Journal of Research and Development. ,vol. 13, pp. 266- 271 ,(1969) , 10.1147/RD.133.0266
Mauro Ciappa, Selected failure mechanisms of modern power modules Microelectronics Reliability. ,vol. 42, pp. 653- 667 ,(2002) , 10.1016/S0026-2714(02)00042-2
D. Barlini, M. Ciappa, M. Mermet-Guyennet, W. Fichtner, Measurement of the transient junction temperature in MOSFET devices under operating conditions. Microelectronics Reliability. ,vol. 47, pp. 1707- 1712 ,(2007) , 10.1016/J.MICROREL.2007.07.008
D. Barlini, M. Ciappa, A. Castellazzi, M. Mermet-Guyennet, W. Fichtner, New technique for the measurement of the static and of the transient junction temperature in IGBT devices under operating conditions Microelectronics Reliability. ,vol. 46, pp. 1772- 1777 ,(2006) , 10.1016/J.MICROREL.2006.07.058
Pat Wheeler, Jon Clare, Liliana de Lillo, Keith Bradley, Martin Aten, Chris Whitley, Graham Towers, A Reliability Comparison of a Matrix Converter and an 18-Pulse Rectifier for Aerospace Applications international power electronics and motion control conference. pp. 496- 500 ,(2006) , 10.1109/EPEPEMC.2006.4778448
Viorel Banu, Xavier Jorda, Josep Montserrat, Philippe Godignon, Jose Millan, Pierre Brosselard, Accelerated test for reliability analysis of SiC diodes international symposium on power semiconductor devices and ic's. pp. 267- 270 ,(2009) , 10.1109/ISPSD.2009.5158053