Contacting of construction elements on substrates
作者： Daniel Mueller , Joachim Tiedeke , Ralf Gross
DOI:
关键词:
摘要: The circuit arrangement has carrier (10) having electric conductor tracks (16) and semiconductor device such as optoelectronic component e.g. optical application-specific integrated (ASIC) (11), which is electrically conductively connected to the electrical of carrier. comprises a photosensitive surface (12) arranged on side facing away from carrier, exposed through silicon-via hole (13) so directly connect with Independent claims are included for following: (1) microelectronic assembly; (2) transmitting and/or receiving signals.
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