Optical device and method for manufacturing same
作者： Sano Hikari , Nakano Takahiro
DOI:
关键词:
摘要: Provided is an optical device capable of preventing occurrence noise caused by reflected light on the outer peripheral end surface a light-transmitting substrate and increasing occupancy rate effective region substrate. The provided with semiconductor (1) which light-receiving element (2) formed, (4) above so as to cover fixed means adhesive layer (5), wherein comprises, thereof, curved inclined spread out from upper toward lower surface.
lens.org 参考文章(7)
Eiji Watanabe, 潤 長谷川, 英治 渡辺, Jun Hasegawa, Solid-state image pick-up element of cog structure ,(1995)
So Wata, Hisashi Nakajima, Camera assembly and its installation structure ,(2006)
Bonshihara Manabu, SOLID-STATE IMAGING APPARATUS, ITS MANUFACTURING METHOD AND CAMERA MODULE ,(2008)
Shinji Uie, 眞司 宇家, Backside irradiation solid state image sensor and its manufacturing method ,(2007)
Yamamoto Hideo, SOLID-STATE IMAGE SENSOR ,(1988)
Yamamoto Kiyobumi, Maeda Hiroshi, Nishida Kazuhiro, SOLID STATE IMAGING APPARATUS AND MANUFACTURING METHOD THEREOF ,(2006)
Motoki Kobayashi, Tsutomu Kume, Ryoko Amano, Hiroyuki Shiota, Makoto Omata, Kumiko Tsukuda, Kanako Tamamatsu, Tetsuya Oda, Kazuhiko Nishiwaki, Kazunori Takagi, Hidefumi Fukasawa, Image pickup device ,(2006)