Semiconductor Die Attachment Method Using Non-Conductive Screen Print and Dispense Adhesive

摘要: A uniform layer of non-conductive material, e.g., epoxy, is screen printed onto the backside an integrated circuit wafer to a required thickness, and then heated until it hard cured (C-stage). The having coating sawn apart separate individual dice. adhesive dispensed mating faces die attach paddles leadframes. dice are placed into paddle assembly cure between paddle. This provides long term electrical isolation from paddle, effectively eliminates silver migration which causes conductive paths form that increase unwanted leakage currents in ultimately cause failure during operation thereof.