Method of fabricating semiconductor chip package using screen printing of epoxy on wafer

摘要: A layer of nonconductive epoxy is applied to a semiconductor wafer by screen-printing process before the separated into individual dice or chips. The as number sublayers. Each sublayers cured, except for final sublayer, which partially cured. After has been wafer, dice. then attached die pad, plurality leads, another die, using preformed layer, pressing against leads at selected force and temperature. Applying in manner described, dicing, allows it be made significantly thicker than conventionally formed layer. This prevents leakage current between element on mounted.