Semiconductor die attachment method and apparatus
作者： Chad A. Cobbley , Tongbi Jiang , Ed A. Schrock
DOI:
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摘要: A method for attaching a semiconductor die to leadframe is provided. Also provided are an improved package, and system performing the method. The includes applying instant curing adhesive, such as cyanoacrylate monomer or anaerobic die, then polymerizing adhesive at room temperature ambient atmosphere, form cured layer between lead frame. catalyst can be applied leadframe, initiate polymerization. In addition, fillers added improve various electrical physical characteristics of resultant layer. dispensing mechanism on attach positioning placing in contact with dispensed adhesive.
lens.org 参考文章(37)
D Melody, Sullivan D O, Cyanoacrylate adhesive compositions having improved thermal resistance ,(1971)
Alan Edward Litke, Thixotropic cyanoacrylate compositions. ,(1984)
Louis J. Baccei, Curable polybutadiene-based resins having improved properties ,(1980)
Shabbir Attarwala, Thermally resistant cyanoacrylates employing substituted napthasultone additive ,(1992)
Steven T. Nakos, John G. Woods, Di-α-cyanopentadienoate disiloxane compounds for use in adhesives ,(1994)
Yukinori Nishino, Chiaki Hata, Alpha-cyanoacrylate adhesive composition ,(1995)
Steve W. Card, Joseph R. West, Underwater bonding of surface-conforming material ,(1987)
Steven G. Thummel, David R. Hembree, Derek Gochnour, Warren M. Farnworth, James M. Wark, John O. Jacobson, Salman Akram, Semiconductor package with pre-fabricated cover and method of fabrication ,(1997)
Toshio Okuyama, Asako Kaai, Shin Takahashi, Cyanocrylate adhesive composition ,(1993)