Low volume showerhead with faceplate holes for improved flow uniformity

摘要: A showerhead in a semiconductor processing apparatus can include faceplate through-holes configured to improve the flow uniformity during atomic layer deposition. The having plurality of for distributing gas onto substrate, where includes small diameter through-holes. For example, each be less than about 0.04 inches. In addition or alternative, edge positioned circumferentially along ring greater substrate being processed. low volume and baffle proximate one more inlets communication with plenum showerhead. and/or overall film non-uniformity, azimuthal non-uniformity at enable operation higher RF powers.