作者: Q. Lin , F. Jiang , X.-Q. Wang , Z. Han , Y.-C. Tai
关键词:
摘要: We have made many versions of MEMS thermal shearstress sensors and they been used in applications successfully. However, it has found that the classical 1-D theory for conventional is inapplicable to our sensors. This paper then presents a systematic study this issue first time, an adequate theoretical analysis developed obtained new model excellent agreement with experimental data. It 2-D shear stress sensor be include heat transfer effects are normally ignored by theory. Not only experimentally confirm model, we also performed 3D simulation results support proposed