Method and system for a high-density plasma deposition process for fabricating a top clad for planar lightwave circuit devices

摘要: A method for performing high aspect ratio gap fill during planar lightwave circuit top clad deposition. plurality of waveguide cores are formed on a substrate, the having gaps there between. cladding layer is over and substrate using high-density plasma deposition process. The refractive index controlled by dopant to be higher than layer. An anneal process performed after between can smaller 2 microns. greater 3. provides very purity USG (undoped silica glass) BPSG (Boron Phosphorous layers uniform index. overlying doped glass deposited HDP PECVD (plasma enhanced chemical vapor deposition) techniques. comprise or GeBPSG (Germanium Boron glass).