Influence of Cutting Speed on Subsurface Damage Morphology and Distribution in Ground Fused Silica

摘要: In optical fabrication, brittle-hard materials are used for numerous applications. Especially high-performance optics laser or lithography applications, a complex and consistent production chain is necessary to account the material properties. Particularly in pre-processing, e.g., shaping components, brittle behavior dominant which leads rough surface layer with cracks that reach far below surface. This so called subsurface damage (SSD) needs be removed subsequent processes like polishing. Therefore, it essential know extent of SSD induced by an efficient design precise corrective process improvement. Within this work influence cutting speed on SSD, fused silica, grinding has been investigated. To analyze crack distribution maximum depth magnetorheological finishing appointed polish wedge into ground The profile was analyzed image processing. For purpose coherent area polished recorded stitching microscopy. Taking form deviation determine actual beneath surface, accuracy SSD-evaluation could improved significantly. experiments reveal clear higher speeds generate less SSD. Besides length itself verified. Based analysis possible, predict means length.