Electro-thermo-mechanical analyses on silver sintered IGBT-module reliability in power cycling

摘要: New demands on the thermo-mechanical design of sintered silver interconnections emerge. Development this inter-connection technology and both experimental theoretical studies their reliability were subjects project “PROPOWER”. The focus paper is analysis risks a demonstrator, an insulated-gate bipolar transistor (IGBT) module, subjected to power cycling loadings. Coupled electro-thermal-mechanical analyses have been carried out using finite element method (FEM). Introduction new interconnect material means at same time introduction constitutive behavior failure modes. As stiffness increases, decoupling effect compliant solder layers reduces intrinsic mechanical stresses increase in whole stack. This leads one hand less low cycle fatigue interconnect, as plastic dissipation reduced, but other higher like brittle cracking sub-critical crack growth. However, if early can be avoided by appropriate designs, interconnection allows several hundred percent. Based complex framework simulation results are validated testing order achieve trustworthy predictions. Failures chip metallization damage different mechanisms die bond either or sinter used related stress situations module.