Reliability investigations for high temperature interconnects

摘要: Purpose – Because of the need for electronics use at temperatures beyond 150°C, high temperature resistant interconnection technologies like transient liquid phase (TLP) soldering and silver sintering are being developed which not only replacements high-lead solders, but also open new opportunities in terms resistance reliability. The paper aims to address thermo-mechanical reliability issues that have be considered if will applied. Design/methodology/approach A TLP technique is briefly introduced challenges concerning power devices worked out by numerical analysis (finite element simulation). They arise as material properties interconnect materials differ substantially from those known soft solders. effective responses determined localized unit cell models capture inhomogeneous structure materials. Fin...