Technique for evaluating a fabrication of a die and wafer

摘要: The fabrication of the wafer may be analyzed starting from when is in a partially fabricated state. value specified performance parameter determined at plurality locations on an active area die wafer. known to indicative particular process fabrication. Evaluation information then obtained based variance locations. This done without affecting usability chip that created die. evaluation used evaluate how one or more processes include was indicated by performed.