Design of high density structures with laser etch stop

作者: Charles R. Davis , Eugene R. Skarvinko , Frank D. Egitto

DOI:

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摘要: A multi-layer electronic circuit package including at least one electrically conductive plane, a first organic polymeric dielectric material having optical absorbency to an ablating wavelength of laser light, and second the light. The absorbencies being different from each other. layer materials overlays surface plane with in layer.

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