Cobalt based interconnects and methods of fabrication thereof
作者： Ramanan V. Chebiam , Tejaswi K. Indukuri , Colin T. Carver , Christopher J. Jezewski
DOI:
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摘要: An embodiment includes a metal interconnect structure, comprising: dielectric layer disposed on substrate; an opening in the layer, wherein has sidewalls and exposes conductive region of at least one substrate line; adhesive comprising manganese, over sidewalls; fill material, cobalt, within surface adhesion layer. Other embodiments are described herein.
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