Atomic layer deposition of a copper-containing seed layer
作者： Scott B. Clendenning , James M. Blackwell , Patricio Romero , John Plombon
DOI:
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摘要: The present disclosure relates to the field of microelectronic device fabrication and, more particularly, formation copper-containing seed layers for interconnects in integrated circuits. may be formed an atomic layer deposition process with a copper pre-cursor and organometallic co-reagent.
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