Apparatus and method for substrate processing
作者： Joya Satoshi , Tohru Watari , Kazuyoshi Takeda
DOI:
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摘要: A substrate processing apparatus 10 includes a holding table 20 for rotatably wafer W, nozzle 40 supplying chemical solutions L 1 and 2 to the at least one light irradiation units G 2, pot 30 placed in outer radius of collecting that are scattered from W. The also cover 70 can be moved direction axis so plurality solution chambers M formed by changing position 70.
lens.org 参考文章(9)
Chih-Chen Chuang, Cheng-Hsiang Huang, Der-Yun Liu, Dual cup spin coating system ,(2001)
Franz Sumnitsch, Support for slice-shaped articles and device for etching silicon wafers with such a support ,(1988)
Hideyuki Murooka, Masato Tsuchiya, Shunichi Ogasawara, Wafer rotary holding apparatus and wafer surface treatment apparatus with waste liquid recovery mechanism ,(2003)
Masaaki Yoshida, Fumio Satou, Norio Uchihira, Hiroshi Hashimoto, Yoshitaka Matsuda, Substrate cleaning unit and cleaning method ,(1999)
Franz Sumnitsch, フランツ・スムニチェ, Support for disk-shaped articles ,(1994)
Mitsunori Nakamori, Hiroki Taniyama, Takanori Miyazaki, Device for processing substrate ,(2000)
Kojima Masaru, Takaishi Kenji, SUBSTRATE PROCESSING APPARATUS ,(2004)
Takayuki Tomoeda, Kiyohisa Tateyama, Masafumi Nomura, Processing apparatus and processing method ,(1997)
Hidetami Yaegashi, Yasuhiro Sakamoto, Film forming method and film forming apparatus ,(2001)