Formation of alloy liner by reaction of diffusion barrier and seed layer for interconnect application
作者： Daniel C. Edelstein , Takeshi Nogami , Chih-Chao Yang
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摘要: An interconnect structure including an alloy liner positioned directly between a diffusion barrier and Cu seed layer as well methods for forming such are provided. The of the present invention is formed by thermally reacting previously deposited metal with overlying layer. During thermal reaction, alloys from both react reaction product
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